System in Package & Miniaturization of RF Modules

SiP (System-in-Package)
and thin-film technologies are redefining RF & Microwave design by delivering maximum performance in minimum volume.

Leaders such as CRHM and SIAE Microelettronica integrate complex RF functions into compact, low-loss, highly reliable modules that enable faster, lighter and more efficient systems across telecom, defence and high-density electronics. From ceramic 3D stacks to thin-film RF subsystems cuts size and weight while boosting bandwidth, thermal performance and manufacturability.

Designed for customers who need more capability in less space, these technologies power the next generation of high-performance RF modules.