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Thin Film
& alumina circuit production
SIAE MICROELETTRONICA is an international telecommunications company based in Milan, leader in wireless network transport
solutions with more than sixty years’ experience.
SIAE MICROELETTRONICA has wide in-house capabilities, from RF and digital design labs, fabrication and testing of RF components and Systems in Package, to high-throughput SMT assembly.
SIAE MICROELETTRONICA offers its experience and capabilities to provide build-to-print as well as build to spec.
We offer advanced Thin Film Production & Chip&Wire technology to provide MultiChip Module and System in Package assembly, to conventional SMT.
WE PARTNER WITH
RF Filter Design Services
• Edge-coupled microstrip bandpass (BPF) and lowpass filters (LPF)
• Quarter- and half-wavelength meandered resonators for compact BPF design
• Absorptive filters with TaN 50 Ohm/square loads
• Substrate integrated waveguide (SIW) interconnections, filters and loads up to E-band.
ALumina Thin Film Filters
Low-loss substrates (i.e. alumina and quartz) and traces (Au with custom
thickness)
• Up to E band (90 GHz)
• Build-to-print service or internal design upon customer’s requirements
• SMD-assembly compatible
• Ad-hoc alumina-PCB transitions
• Connectorized eval board or probe station pads available
For inquiries please fill out the form and one of our specialists will contact you.
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